Solder Wires

We offer a wide range of Solder wires and other allied products manufactured to Indian and various other International specifications. Wires are manufactured in 5 core /3 core and single core including solid wires. 5 core ensures flux melts before solder, to wet the surfaces to be joined, avoiding flux voids, to form high quality uniform soldering.

• Rosinol Solder Wire
• Solid Solder Wire
• Corrosol Solder Wire
• No Clean Wire
• Water Soluble Flux Cored Wire

• Rosinol Solder Wire

Rosinol Multi-core solders are in the form of a continuous wire with Five cores symmetrically arranged around the perimeter of the wire, separating the flux cores by a thin wall of solder. This formation ensure that the flux melts before the solder to wet the surfaces to be joined, and so form high quality uniform joints. There is no need for extra flux, eliminating one operation in the soldering process.

• Rosinol Solder Wire with 105 Flux

Most popular in entertainment and professional Electronic Industries, such as Television, Telecommunications, Computers etc. It has low halide content (0.5% Max.), non-corrosive, activated flux. It can be offered in various metal compositions.

• Rosinol Solder Wire with 101 Flux

Most suitable in soldering difficult surfaces and containing flux with high halide content (1% Max.). Finds use in mass production items like lamps, capacitors, fuses etc.

• Rosinol Solder Wire with 100 Flux

Used extensively in defense electronics and avionics due to its mild activity and freedom from halogen based activators.

• Solid Solder Wire

Solder wires without fluxes manufactured using highest purity metals in required TIN/LEAD compositions and gauges.

• Corrosol Solder Wire

Corrosol acid core solder is useful in metal fabrication such as radiators, tin containers, soldering of fuse wire to detonators and for various other applications, replacing poisonous Zinc chloride fluxes without loss on performance. Can be supplied in various Tin/Lead compositions.

• No Clean Wire

Containing non-corrosive, rosin free flux, usually incorporating complex activators. The range consists of numerous alloy/flux combination covering every electrical/electronics soldering application available in Single Core in most solder alloys.

• Water Soluble Flux Cored Wires

Used extensively in the manufacture of the telecommunication equipment. It is very corrosive and needs cleaning with deionized water.

THICKNESS: We can supply Solder Wire from 8 swg (4.0 mm) to 30 swg (0.31 mm).

Sticks, Bars and Anodes

Solder Sticks / Bars

Alloys in the form of Solder Sticks / Extruded Bars / Ingots are manufactured using virgin metals conforming to Indian and International specifications. It can be supplied in any Tin / Lead composition for all applications including wave soldering. Popular alloy composition is 63 / 37 (Tin / Lead), which is a Eutectic composition (Melting at 183° C) and 60 / 40 (Tin / Lead) sticks.

Pure Tin Anodes and Tin/ Lead Anodes

Manufactured using highest purity metals in pure Tin and any solder alloy compositions. The most popular are 60/40 alloys. Ideal for plating of copper conductors on printed circuit Boards to extend shelf life.

Use of virgin metals and control of metallic impurities to a minimum level in manufacturing process results in optimum performance of anodes. Excessive metallic impurities in plating anodes can cause sludge formation on anodes, necking of anodes, darkening of the deposited electroplate and inferior re-flow characteristics of the deposit. Strict control on the Tin content of anodes provides added reliability.

Casting is normally the most economical method for fabricating Tin and Tin/Lead plating anodes. The major disadvantage is that excessive grain growth due to slow cooling and alloy segregation may result. The preferred method for anode manufacture is extrusion. BT Plating Anodes are extruded under high pressure, which assures a dense, fine grain structure with continuous uniformity. Uniform dissolution of the anode in the plating bath results, with necking reduced to a minimum. The fine grain size permits the use of higher current densities without making the anodes passive.

The high purity and uniformity of BT Plating Anodes provides improved anode efficiency. This means a longer anode life, fewer chemical additions to the plating bath, better soldering of plated parts and an overall economy in use.

Solvent Cleaners

Characteristics

WS-24 SOLVENT CLEANER is a blend of polar and non-polar solvents ideally suited for cold cleaning utilizing ultrasonic agitations and wave or bottom brush equipment. The non polar component effectively removes non ionic solids such as soldering oils and rosin flux residues where as the polar components dissolves ionic contaminants such as flux activators which if left on printed circuit boards can cause current leakage and corrosion under humid environmental conditions. The cleaner is completely stabilized against thermal and chemical breakdown.

WS-24 boils at a temperature much higher than the customary Fluorinated solvents (about 46C) and chlorinated solvents (about 72C) as a result of which the solvent evaporation rate at room temperature is substantially lower making it highly economical to use.

The cleaner is non-flammable and non-combustible and therefore extremely safe to use.

Application

Though most types of component materials and markings are not affected by WS-24, some plastics are, such as Polystyrenes and Polycarbonates. It is therefore necessary to establish solvent component capability prior to use.

Properties

• Appearance - Clear, Mobile Liquid
• Specific Gravity at 25 Deg. Cent - 1.505 +/-0.015
• Boiling Point - 116C(240.8F)
• Freezing Point - 0C(32F)
• Evaporation Rate (Ether =1) - 0.16

Health & Safety

Though WS-24 does not have an objectionable odor, a well ventilated working area is necessary. Splashing on skin should be removed by washing with soap and water. If the material comes in contact with the eyes, they should be irrigated thoroughly with running water for at least 10 minutes. In extreme cases medical attention should be sought.

Packaging

5,10 and 20 Litres. Jerry Cans. 200 Litres Drums

Introduction

Lead Free Solder Paste Sn96.5 / Ag3 / Cu0.5 is an air re-flow, no clean solder paste, specially formulated to accommodate the higher processing temperature required by Sn / Ag - Pb Free Alloy systems favored by the electronic industry to replace conventional Pb bearing solders. The Product formulation offers consistent repeatable printing performance combined with a long Stencil and Tack Time.

Alloy

BT Uses Low Oxide spherical powder composed of Sn / Ag in a standard type - III Mesh Size.  The weight ratio of the flux to solder powder is referred to as the metal load typically in the range of 90% for standard alloy.

Storage And Handling

Refrigerated storage will prolong the shelf life of Solder Paste. The shelf life of the paste is 6 months. Solder Paste should be allowed to reach ambient working temperature prior to use. Generally paste should be removed from refrigeration at least 2 hrs before use. 

Re-Flow

This profile is designed for use with Sn96.5/Ag3.5. It will serve as general guideline in establishing a re-flow profile. Adjustments to this profile may be necessary based on specific process requirements.

Product Specification

MATERIAL: 96.5/3/0.5 Sn/Ag/Cu Solder Paste. 

TYPE: No Clean

REFERENCE SPECIFICATION: ANSI-J-STD-004

Physical Properties

STANDARD ALLOY: 96.5 / 3 / 0.5

POWDER MESH SIZE / SHAPE: -325 + 500, 25 Microns, Spherical, TYPE-III

METAL CONTENT: 90%

FLUX PERCENT: 10%

Other Parameters

CORROSION: Passes Copper Mirror Corrosion Test

HALIDE DETECTION TEST: Passes Chromate Paper Test

HALIDE CONTENT: NIL

INSULATION RESISTANCE: SIR 7 DAYS @ 85 C 85% RH-10" Mega OHMS

SOLUBILITY / WASHABILITY: ISO Propyl Alcohol

STORAGE: Store in Refrigeration @ 15° C

SHELF LIFE: 6 Months Under Refrigeration

Introduction

Sn62 Solder Paste is a Halide Free, No Clean Solder Paste & RMA Type; formulated to leave completely invisible residue of the flux. This product has a superior wetting capabilities. The paste can be used in both Stencil Design and Printer Operation.

Alloy

BT Uses Low Oxide spherical powder composed of Sn/Pb/Ag in a standard type - III Mesh Size.  The weight ratio of the flux to solder powder is referred to as the metal load typically in the range of 88-92% for standard alloy. 

Storage And Handling

Refrigerated storage will prolong the shelf life of Solder Paste. The shelf life of the paste is 6 months. Solder Paste should be allowed to reach ambient working temperature prior to use. Generally paste should be removed from refrigeration at least 2 hrs before use. 

Re-Flow

This profile is designed for use with Sn62/Pb36/Ag2. It will serve as general guideline in establishing a re-flow profile. Adjustments to this profile may be necessary based on specific process requirements.

Product Specification

MATERIAL: 62/36/02 Sn/Pb/Ag Solder Paste. 

TYPE: No Clean (RMA)

REFERENCE SPECIFICATION: ANSI-J-STD-004 RELO

Physical Properties

STANDARD ALLOY: 62/36/02

POWDER MESH SIZE / SHAPE: -325 + 500, 25 Microns, Spherical, TYPE-III

METAL CONTENT: 88 +92%

FLUX PERCENT: 12+12-8%

Other Parameters

CORROSION: Passes Copper Mirror Corrosion Test

HALIDE DETECTION TEST: Passes CHROMATE PaperTest

HALIDE CONTENT: NIL

INSULATION RESISTANCE: SIR 7 DAYS  @ 85 C 85% RH-10" MEGA OHMS

SOLUBILITY / WASHABILITY: ISO PROPYLE ALCOHOL

STORAGE: STORE IN REFRIGERATION @ 15° C

SHELF LIFE: 6 MONTHS UNDER REFRIGERATION

Rosin Foam Flux - WS31

Characteristics

WS31 Rosin Foam Flux is an activated, Non-Corrosive Rosin based liquid flux, which has been specially formulated to reduce Icicles and bridging to a minimum on PCB. The minimal residues left on the boards are non-sticky, protective and non-corrosive. WS 32 & WS 38 are Rosin mildly activated flux with different solid contents. It can also be offered in various solid content.

Application

ROSIN Liquid Flux can be used for the Wave/Dip/Spray soldering of all printed circuit boards to give fast production speeds and reliable soldering. Because of its special action of suppressing Icicles and bridging, it will be found that soldering machine setting are not so critical as with other Rosin based fluxes.

Flux Control

The concentration of Rosin based flux increases during usage because of loss of the solvent. The concentration of the flux can easily be maintained by replacing the lost solvent periodically with WS 71 thinner. The specific gravity of the modified solution is monitored by using Hydrometer until it reaches required specific gravity.

Removal Of Flux Residue

Due to its solid content, this flux leaves only traces of non-corrosive residues. If removal of the residues becomes necessary, it can be done by washing with commercial solvent mixture. All known cleaning processes can be employed.

Technical Data

Safety Information

Take all normal precautions for its handling, use, and storage. It should be used in a well ventilated area. Keep away from sources of flame and heat. The prescribed containers must be stored tightly closed in a well-ventilated area.

Packaging

5, 10, 20 Litres.Cans 200 Litres Drums

No Clean Flux NCF 700

Characteristics

BT's NCF 700 NO Clean Flux is a low solids, rosin free, zero residue, organic flux with good foaming characteristics, which has been specially formulated to reduce the icicles and bridging to a minimum on PCB. The minimal residues left on the Boards are non-sticky, protective and non corrosive. It can also be offered in various solid content.

Application

It can be used for the Wave/Dip/Spray Soldering to give fast production speed and reliable soldering. The flux tank should be kept full and will require a higher air pressure setting than higher solids content flux. Very small Wave Soldering Machine with an internal small air compressor may need an external compressor to increase the air pressure. It is important to remove moisture from the air supply as Water absorption can affect soldering performances.

Pre-Heat Temperature

To be maintained minimum 115° C on the top side of PCB. Lower Pre-heat temperature shall give room for white residue.

Flux Control

The specific gravity of the flux should be monitored with hydrometer. If the specific gravity of the flux is above 0.795, due to loss of solvent the concentration of the flux can easily be maintained by addition of thinner. The specific gravity of the modified solution is monitored by using hydrometer until it reaches the required specific gravity.

Removal of Flux Residue

Due to lower solid content, it leaves only traces of non-corrosive residue which can normally be left on the surface. Should removal of the residues be necessary, all known cleaning process can be employed.

Characteristics

It is a blend of activators dissolved in a solution. It is Rosin free. It leaves behind corrosive residue.

Application

BT Corrosol liquid flux is used for tinning component leads and other fabrication soldering. Post cleaning is required.

Properties

The flux is very effective and active. It can be applied by brush or by dipping. Flux control is not required, thereby thinner addition is eliminated.

Removal of Flux Residue

Residue can be removed with tap water by rinsing. All known cleaning processes can be employed.

Safety Information

The flux is non-flammable. Take all normal precautions for its handling, usage and storage. No shelf life.

Packaging

It can be supplied in 5,10 and 20 Litres. Jerry can.

Non-Corrosive Liquid Flux 406A

Characteristics

It is a blend of activators dissolved in a solution. It is Rosin free. It leaves behind no corrosive residue at higher temperature (400° C to 450° C).

Application

BT 406A non-corrosive liquid flux is used for tinning component leads and cable joints or assemblies. Post cleaning can be dispensed with at high temperatures.

Properties

The flux is very effective and reliable. It can be applied by brush or by dipping. Flux control is not required, thereby thinner addition is eliminated.

Removal Of Flux Residue

Not required when used at higher temperatures (400° C to 450° C). When used at lower temperature it leaves traces of corrosive residue, which can be normally cleaned with ordinary tap water or deionized water or with commercial solvent mixture. BT's solvent cleaner can be used. All known cleaning process can be employed.

Technical Data

• APPEARANCE - Colorless Liquid
• SPECIFIC GRAVITY - 1.06 + 0.01
• SOLID MATTER - 19 + 1%
• FLASH POINT - NONE

Safety Information

The flux is non-flammable. Take all normal precautions for its handling, use and storage. No shelf life.

Packaging

It can be supplied in 5, 10, 20 Litres Jerry can

Water Soluble Flux

Characteristics

It has been devised specifically for use in the electronics industry. They are extremely active fluxes, which help rapid and efficient soldering of the most difficult to solder parts. The water-soluble flux is more active than the rosin based flux and hence defect free soldering is obtained even with PCB and component leads with poor solder-ability. There are three types of Water Soluble Liquid Fluxes used in wave soldering printed circuits having 10%, 20 % and 40% solid content.

Application

Method of application foam type. Flux can be used for the WAVE / DIP soldering of all printed circuit boards to give fast production speeds and reliable soldering. Before using Water Soluble Flux, the components must be assessed as being able to with stand the necessary washing procedures.

It is important that the cleanliness of boards and components are thoroughly checked after soldering and cleaning. The usual procedure is to check the conductivity of the final rinse water as a measure of ionic contamination.

Flux Control

During Wave Soldering operation, flux thickens due to solvent evaporation. To restore it to the specific gravity add WS 71 thinner.

Removal Of Flux Residue

The residues, which must be removed, are quickly washed away by deionized water without the need of any added neutralizers or cleaners.

Safety Information

Take all normal precautions for its handling, use and storage. It should be used in a well-ventilated area. Keep away from sources of flame and heat. The prescribed containers must be stored tightly closed in a well-ventilated area.

Packaging

It can be supplied in 5,10 and 20 Litres. Jerry can.

Hot Air Levelling Flux - BT102

Characteristics

HAL Flux is a Water Soluble Liquid Flux used in solder coating exposed Copper areas of Printed Circuit Boards in Hot Air Levelling Machine. The Fluxes gives a controlled even coating thickness, providing a well preserved, compatible surface for subsequent soldering.

The Flux also acts as a Lubricant during Insertion / removal of the PCB from the holder and because of its low evaporation and decomposition rates, does not create undue fuming of discolored residues on the molten solder surfaces.

To achieve optimum shelf life and soldering of boards, a high purity alloy such as 63/37 Solder should be used.

HAL Flux  which is free from Glycol and has higher temperature stability.

Application

After application of HAL Flux to the PCB in the Machine, the board is dipped into the Molten High Purity Solder, withdrawn at a controlled rate and excess solder is leveled by passing the PCB through Hot Air Knives. Because of its special action of suppressing icicles and bridging, it has much greater resistance to discoloring and fuming than other fluxes which are Rosin based.

Flux Residue

The residues are Water Soluble and are Biodegradable. They can be removed using hot water (60° C).

Properties

• Specific Gravity - 1.02 Less or More by 1
• Halide content - Less than 2%
• Flash Point - Greater than 280° C.
• Viscosity CPS at 25° C. - 67
• TLV of Solvents - 400 ppm
• PH - 2.5
• Evaporation Rate - Negligible at Room Temperature

Packaging

Ready to use in 5, 10, 20 Litres. Jerry Can.